2021, March 11th @13:00 (GMT-4)


      The drive to enhance printed electronics demands improved performance from printed conductive layers. Significant advances have been made to make the final prints (1) stretchable and bendable, (2) enhance adhesion to substrate, (3) increase conductivity, (4) applicable to thermally sensitive substrates (such as PET, PEN or TPU), (5) solderable and (6) provide a high degree of densification. To achieve the optimum performance, a holistic view of the printing apparatus, substrate wettability and curing parameters are needed. This presentation will focus on the best path to achieve the stated performance criteria by reviewing the available parameters. In addition, discussing how ink rheology, particle size and humectant loading can be tailored for best performance.

NovaCentrix has been a leader in printed electronics for the past 20 years by offering world class conductive inks and processing equipment. The innovative photonic curing process provides a route to circumvent many of the material road blocks experienced in oven processing. An overview of product offerings from NovaCentrix and potential advantages will be given during this discussion.


Speaker: Dr. Vahid Akhavan

Job Title: 

Global Application Engineering Lead 

Company Name:                Novacentrix

Dr. Vahid Akhavan is the Global Application Engineering Lead at Novacentrix, based in Austin, Texas.  He received his Ph.D. degree in Chemical Engineering from the University of Texas at Austin under the supervision of Dr. Brian Korgel.  His Ph.D. thesis focused on printed and flexible Cu(In1-xGax)Se2 photovoltaic devices with strong emphasis on colloidal synthesis, inorganic chemistry and electronic device fabrication.  He joined NovaCentrix after graduation.  He has over 15 years of experience in the Printed Electronics field, over 20 peer reviewed publications, several patent applications and has presented at numerous technical seminars and workshops.  His current research interests involve creating functional electronic devices on inexpensive flexible substrates.